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US Patent Issued to NXP USA on Nov. 3 for "Transistors with dielectric spacers and methods of fabrication thereof" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,402, issued on Nov. 3, was assigned to NXP USA Inc. (Austin, Texas). "Transistors with dielectric spacers and methods of fabrication thereof... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Gate sidewall structures of semiconductor devices and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,403, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Gate sidewall structures of semic... Read More


US Patent Issued to FAST SIC SEMICONDUCTOR on Nov. 3 for "Silicon carbide semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,404, issued on Nov. 3, was assigned to FAST SIC SEMICONDUCTOR Inc. (Hsinchu City, Taiwan). "Silicon carbide semiconductor device" was invent... Read More


US Patent Issued to GLOBALFOUNDRIES U.S. on Nov. 3 for "High electron mobility transistor" (Vermont Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,405, issued on Nov. 3, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "High electron mobility transistor" was invented by Brett T.... Read More


US Patent Issued to ROHM on Nov. 3 for "Semiconductor device having dual trench structures and an impurity region" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,407, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device having dual trench structures and an impurity reg... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Vias and via rails for source/drain metal full contact" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,408, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Vias and via rails for source/dra... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor device having two-dimensionally active regions separated by device isolations including word lines and bit lines" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,409, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device having two-dimensionally ... Read More


US Patent Issued to WOLFSPEED on Nov. 3 for "Semiconductor power devices having multiple gate trenches and methods of forming such devices" (North Carolina Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,410, issued on Nov. 3, was assigned to WOLFSPEED INC. (Durham, N.C.). "Semiconductor power devices having multiple gate trenches and methods... Read More


US Patent Issued to Volta Semiconductor on Nov. 3 for "Semiconductor power device" (British, Cypriot, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,411, issued on Nov. 3, was assigned to Volta Semiconductor Inc. (Cupertino, Calif.). "Semiconductor power device" was invented by Valerii Ne... Read More


US Patent Issued to Applied Materials on Nov. 3 for "Semiconductor devices containing bi-metallic silicide with reduced contact resistivity" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,412, issued on Nov. 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Semiconductor devices containing bi-metallic silicide ... Read More